As consumer electronics products are gradually becoming lighter, thinner and smarter, higher requirements have been placed on display technology and data transmitter processing capabilities. The diversification of applications and the reduction in volume have also forced printed circuits board to arrange more wires in a limited area and continuously develop into ultra-fine directions such as fine trace width, dense wiring, and fine craftsmanship. High density, thin and light, FPC, rigid-flex board and environmentally-friendly production have gradually become the future direction for the development.